Lithography masks and methods of manufacture thereof

ABSTRACT

Lithography masks and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of manufacturing a lithography mask. The method includes providing a substrate, forming a first pattern in a first region of the substrate, and forming a second pattern in a second region of the substrate, the second pattern comprising patterns for features oriented differently than patterns for features of the first pattern. The method includes affecting a polarization rotation of light differently in the first region than in the second region of the substrate.

This application is a divisional of U.S. patent application Ser. No.11/602,886, entitled “Lithography Masks and Methods of ManufactureThereof,” filed on Nov. 21, 2006 now U.S. Pat. No. 7,799,486, whichapplication is hereby incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to the fabrication ofsemiconductor devices, and more particularly to lithography masks usedto pattern material layers of semiconductor devices.

BACKGROUND

Generally, semiconductor devices are used in a variety of electronicapplications, such as computers, cellular phones, personal computingdevices, and many other applications. Home, industrial, and automotivedevices that in the past comprised only mechanical components now haveelectronic parts that require semiconductor devices, for example.

Semiconductor devices are manufactured by depositing many differenttypes of material layers over a semiconductor workpiece or wafer, andpatterning the various material layers using lithography. The materiallayers typically comprise thin films of conductive, semiconductive, andinsulating materials that are patterned and etched to form integratedcircuits (ICs). There may be a plurality of transistors, memory devices,switches, conductive lines, diodes, capacitors, logic circuits, andother electronic components formed on a single die or chip, for example.

Optical photolithography involves projecting or transmitting lightthrough a pattern comprised of optically opaque areas and opticallyclear or transparent areas on a mask or reticle. For many years in thesemiconductor industry, optical lithography techniques such as contactprinting, proximity printing, and projection printing have been used topattern material layers of integrated circuits. Lens projection systemsand transmission lithography masks are used for patterning, whereinlight is passed through the lithography mask to impinge upon aphotosensitive material layer disposed on a semiconductor wafer orworkpiece. After development, the photosensitive material layer is thenused as a mask to pattern an underlying material layer. The patternedmaterial layers comprise electronic components of the semiconductordevice.

There is a trend in the semiconductor industry towards scaling down thesize of integrated circuits, to meet the demands of increasedperformance and smaller device size. However, as features ofsemiconductor devices become smaller, it becomes more difficult topattern the various material layers because of diffraction and othereffects that occur during a lithography process. Lithography techniquessuch as immersion lithography and EUV lithography have been developed orare currently under development to address the lithography challenges ofdecreased feature sizes. Immersion lithography is expected to enable thenumerical aperture (NA) of the projection lens system to be greater than1, for example.

A recent development in lithography is the use of polarized light forthe exposure process. Problems resulting from the polarization of lightand benefits arising from the intentional use of polarized light havebecome matters of interest, particularly with high NA patterning, suchas in immersion lithography.

What are needed in the art are lithography masks and methods ofmanufacture thereof that are effective in exposure processes involvingpolarized light.

SUMMARY OF THE INVENTION

These and other problems are generally solved or circumvented, andtechnical advantages are generally achieved, by preferred embodiments ofthe present invention which provide novel lithography masks and methodsof manufacture thereof.

In accordance with a preferred embodiment of the present invention, amethod of manufacturing a lithography mask includes providing asubstrate, forming a first pattern in a first region of the substrate,and forming a second pattern in a second region of the substrate. Thesecond pattern comprises patterns for features oriented differently thanpatterns for features of the first pattern. A polarization rotation oflight is affected differently in the first region than in the secondregion of the substrate.

The foregoing has outlined rather broadly the features and technicaladvantages of embodiments of the present invention in order that thedetailed description of the invention that follows may be betterunderstood. Additional features and advantages of embodiments of theinvention will be described hereinafter, which form the subject of theclaims of the invention. It should be appreciated by those skilled inthe art that the conception and specific embodiments disclosed may bereadily utilized as a basis for modifying or designing other structuresor processes for carrying out the same purposes of the presentinvention. It should also be realized by those skilled in the art thatsuch equivalent constructions do not depart from the spirit and scope ofthe invention as set forth in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIGS. 1 and 2 show cross-sectional views of a binary lithography mask inaccordance with a preferred embodiment of the present invention atvarious stages of manufacturing;

FIG. 3 shows the lithography mask of FIG. 2 in a perspective view;

FIG. 4 shows the lithography mask of FIGS. 2 and 3 in a cross-sectionalview after an absorber layer of the mask has been patterned across theentire lithography mask and certain portions of material layers of themask have been removed in one region;

FIG. 5 shows a lithography system implementing a lithography mask ofFIG. 4 in accordance with a preferred embodiment of the presentinvention;

FIG. 6 shows a cross-sectional view of a binary lithography mask inaccordance with another preferred embodiment of the present invention;

FIG. 7 shows a cross-sectional view of a semiconductor device that has alayer of photoresist disposed thereon that has been patterned using alithography mask of an embodiment of the present invention;

FIG. 8 shows the semiconductor device of FIG. 7 after the layer ofphotoresist has been used as a mask to pattern a material layer of thesemiconductor device;

FIG. 9 shows a cross-sectional view of an attenuating phase shiftinglithography mask in accordance with an embodiment of the presentinvention;

FIG. 10 shows a cross-sectional view of an attenuating phase shiftinglithography mask in accordance with another embodiment of the presentinvention;

FIG. 11 shows a cross-sectional view of an attenuating phase shiftinglithography mask in accordance with yet another embodiment of thepresent invention; and

FIGS. 12 through 15 show cross-sectional views of an attenuating phaseshifting lithography mask in accordance with an embodiment of thepresent invention at various stages of manufacturing.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the preferredembodiments and are not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the presently preferred embodiments arediscussed in detail below. It should be appreciated, however, that thepresent invention provides many applicable inventive concepts that canbe embodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the invention, and do not limit the scope of the invention.

In some applications, the use of polarized light can enhance the imagingprocess in lithography. However, the direction of polarization that isbest suited for some features, e.g., horizontal features is notnecessarily best suited for other features, e.g., vertical features.Thus, a global definition of the polarizing state of the illuminatinglight may not be sufficient for optimum imaging performance in somelithography processes.

For example, for a horizontal feature, an exposure process usingpolarized light in a horizontal direction is preferred. An exposureprocess for horizontal features using polarized light in a verticaldirection may result in poor contrast and poor resolution of horizontalfeatures formed on a semiconductor device, for example. In manyapplications, it is desirable for horizontal features formed on asemiconductor device to comprise the same dimensions as verticalfeatures, in order to achieve the same operating parameters andelectrical characteristics. As an example, if the features comprisetransistor gates, for example, the widths of the gates largely impactthe operating parameters of the transistors, e.g., the current andvoltage.

However, due to the use of polarized light in the exposure process,features in a horizontal orientation may comprise different dimensionsthan features in a vertical orientation. Features comprising differentdimensions in some semiconductor applications are disadvantageousbecause devices formed have non-uniform performance and operatingcharacteristics, resulting in decreased and unpredictable deviceperformance, decreased yields, and increased manufacturing costs, forexample.

To alleviate this problem, a double exposure process is sometimes usedto form horizontal features and vertical features, using a firstpolarized light and a second polarized light polarized differently thanthe first polarized light. However, a double exposure process requirestwo masks and two exposure processes, which is costly andtime-consuming.

Embodiments of the present invention achieve technical advantages byproviding lithography mask designs and methods of manufacture thereofwherein a single exposure process may be used to form features orientedin different directions on a semiconductor device. The present inventionwill be described with respect to preferred embodiments in a specificcontext, namely in lithography masks used to pattern semiconductordevices. The invention may also be applied, however, to masks used topattern other types of devices in other applications and othertechnological fields, for example.

Embodiments of the present invention utilize polarizing properties oflight to image at least two patterns oriented on different axes with ahigh contrast using a single exposure and a single mask in a lithographysystem. Two polarizing materials are used to alter the polarization ofthe light through a lithography system: a polarization filter that isdisposed on a mask, pellicle, or other locations in the optical path ofthe lithography system, and a polarization rotating material adapted torotate the polarization of the light emitted from the polarizationfilter in some regions of the mask. The polarization filter may comprisea linear polarizing illumination system in some embodiments, e.g.,wherein the source of a lithography system emits polarized light. Thepolarization filter allows only one orientation of polarizing light topass through it, while the active polarization rotating material rotatesthe orientation of the polarized light emitted from the polarizationfilter by 90 degrees or other angles corresponding to the featureorientation of the particular device design.

FIGS. 1, 2, and 4 show cross-sectional views of a lithography mask inaccordance with a preferred embodiment of the present invention atvarious stages of manufacturing. With reference now to FIG. 1, first, asubstrate 106 is provided. The substrate 106 preferably comprises atransparent material such as quartz, although alternatively thesubstrate 106 may comprise other materials, such as glass, as anexample. The substrate 106 preferably comprises a thickness of about ¼inch, for example, although alternatively, the substrate 106 maycomprise other dimensions.

A polarization rotating material 108 is formed over at least some areasof the substrate 106, and in some embodiments, not over other areas ofthe substrate 106. The substrate 106 may be recessed in the areas nothaving the polarization rotating material 108 formed thereon in someembodiments. The polarization rotating material 108 may be disposed inat least a first region 102 of the substrate 106, the polarizationrotating material being adapted to alter a polarization and a phase oflight in at least the first region 102, for example. The mask 100 mayinclude a phase shifting compensating feature disposed in at leastportions of a second region 104 of the substrate 106, the phase shiftingcompensating feature comprising recesses in the substrate 106 adapted tocompensate for the altered phase of light due to the polarizationrotating material 108 in the first region 102, for example, to bedescribed further herein.

To form the polarization rotating material 108, the polarizationrotating material 108 may be disposed over the substrate 106. Thepolarization rotating material 108 preferably comprises a materialadapted to alter or rotate the polarization orientation of polarizedlight passing from the substrate 106 through the polarization rotatingmaterial 108, for example. In some embodiments, the polarizationrotating material 108 is adapted to rotate polarized light by about 90degrees, for example. The polarization rotating material 108 maycomprise a layer of active polarizing materials, e.g., a 90 degreepolarizer. In other embodiments, the polarization rotating material 108is adapted to rotate polarized light at an angle having a range fromabout 0 to 180 degrees, for example. The angle of rotation is preferablyselected to correlate to the orientation of features to be formed on asemiconductor device in a particular region 102 or 104 of the mask 100,for example.

The polarization rotating material 108 preferably comprises abirefringent material and/or an optically active material of aninorganic or organic nature, as examples. The polarization rotatingmaterial 108 of the lithography mask 100 preferably comprises SiO₂,CaCO₃, TiO₂, β-BaB₂O₄, a cholesteric liquid crystal film with a helicalstructure, an optically active alicyclic polymer, an optically activesiloxane, other optically active organic materials or compounds with ahigh transmission to the exposure wavelength used, orfluorine-containing organic materials, as examples. When using 193 nmlight for an exposure process, the polarization rotating material 108may comprise an alicyclic polymer with optical activity induced by thechemical composition and/or structure of the polymer chain and/or itsside-groups, for example. Alternatively, the polarization rotatingmaterial 108 may comprise other materials.

The polarization rotating material 108 preferably comprises a thicknessof about 50 to 300 nm or less, which advantageously may be reproduciblyachieved by conventional deposition or coating techniques established insemiconductor device and mask manufacturing processes, for example.Alternatively, however, the polarization rotating material 108 maycomprise other dimensions.

A pattern-forming material 110 is disposed over the polarizationrotating material 108, as shown in FIG. 1. In some embodiments, firstthe pattern-forming material 110 is disposed over the substrate 106, andthen the polarization rotating material 108 is disposed over thepattern-forming material 110, for example, not shown in the figures. Thepattern-forming material 110 comprises a material layer comprising anabsorber or an attenuating material in some embodiments.

In the embodiment shown in FIGS. 1 through 4, the pattern-formingmaterial 110 comprises an absorbing material or an absorber. Thepattern-forming material 110 preferably comprises chromium (Cr) in someembodiments, although alternatively, the pattern-forming material 110may comprise other materials. The pattern-forming material 110preferably comprises a thickness of about 50 to 100 nm or less, althoughalternatively, the pattern-forming material 110 may comprise otherdimensions.

The lithography mask 100 comprises a first region 102 and a secondregion 104, as shown. The first region 102 comprises a region where thepatterns for features are oriented in a first direction requiring apolarization at a first orientation or a first angle, e.g., 90 degreesor other angles. The second region 104 comprises a region where patternsfor features are oriented in a second direction requiring a polarizationat a second orientation or second angle, e.g., 0 degrees or otherangles. The first angle is different than the second angle, and thefirst orientation of features in the first region 102 is different thanthe second orientation of features in the second region 104, forexample. The difference in the first angle and the second angle maycomprise any angle between 0 and 180 degrees in principle, although forthe majority of practical applications the first angle and the secondangle may be orthogonal to one another (e.g., 90 degrees).

The pattern-forming material 110 is patterned with a pattern forfeatures in the first region 102 and the second region 104, as shown inFIG. 2. Note that the patterned pattern-forming material 110 is shownwherein the features are oriented the same in the first region 102 andthe second region 104 in FIG. 2; however, the patterns in thepattern-forming material 110 are actually oriented differently. Forexample, as shown in FIG. 3 in a perspective view, region 104 is shownrotated by the second angle less the first angle as compared to region102, e.g., wherein the angle is about 90 degrees in the perspective viewof FIG. 3.

The polarization rotating material 108 and a portion of the substrate106 in the second region 104 are then patterned with the pattern of thepattern-forming material 110, as shown in FIG. 4. Using the previouslypatterned absorber material (e.g., the pattern-forming material 110) asa hard mask, the polarization rotating material 108 may be etched awayby an anisotropic dry etch process or other type of etch process, forexample, in the absorber-free mask portions of the second region 104. Inaddition, the top or upper portion of the substrate 106 immediatelybeneath the interface of the substrate 106 to layer 108 may be recessedto a predetermined depth d₁, to be explained further herein, again usingan anisotropic dry etch process or other etch process, for example.Locally selective removal of the polarization rotating material 108 andrecess of the substrate in region 104 may preferably be carried out insequence in the same dry etch chamber, for example. The choice of theetch chemistry or mixture is a function of the chemical nature of theabsorber 110 material and the polarization rotating material 108 used,e.g., to achieve suitable etch selectivity in the etch process.

During removal of the polarization rotating material 108 and apotentially required substrate 106 recess by an amount d₁ in the secondregion 104, the first region 102 is preferably protected, e.g., by aphotoresist layer (not shown) placed over the first region 102 by aconventional block level lithography approach. After completion of theetching of a portion of the substrate 106 in the second region 104, thephotoresist layer covering the region 102 is removed, using a wet or dryresist strip method, as examples.

FIG. 4 also shows the effect on light 138 transmitted by an illuminator(not shown in FIG. 4: see FIG. 5 at 122) impinged upon the novellithography mask 100 of embodiments of the present invention in variousareas 112, 114, 116, and 118 of the mask 100. Light 138 passes throughareas 114 and 118 not having the pattern-forming material 110 disposedthereon, and light 138 is blocked in areas 112 and 116 where thepattern-forming material 110 resides. To achieve 0 degree polarizationrotation in the second region 104, the polarization rotating material108 is etched away from the areas 118 not covered by the pattern-formingmaterial 110, to ensure that light 138 emerging out of the second region104 (i.e., in area 118) is polarized differently than light 138 emergingout of the first region 102 (i.e., in area 114).

However, the polarization rotating material (PRM) 108 in the firstregion 102 may contribute in some embodiments to an additional phasechange of φ_(PRM) in light 138 passing through area 114, therebyaffecting the nature of the interference between light emitted fromregions 102 and 104 in a possibly undesired manner. Such potentiallyundesirable interference effects will not occur if the polarizationrotating material 108 induces a rotation of the polarization plane by 90degrees, because light beams with polarization planes orthogonallyaligned to each other will not interfere. However, for all otherrotation angles deviating from 90 degrees, it is recommendable andpreferable in accordance with some embodiments of the present inventionto eliminate a phase difference between light emitted from areas 114 and118 by compensating for the phase change in areas 114 due to thepresence of the polarization rotating material 108 in region 102 by anaccompanying offset in phase for the light passing through areas 118 ofregion 104.

Thus, in accordance with embodiments of the present invention, as acorrective measure, an additional phase change may be achieved on thetransmitting light 138 through area 118 by over-etching or recessing thesubstrate 106 by an amount d₁, as shown in FIG. 4. The recess amount d₁of the substrate 106 is also referred to herein as t_(R) in theequations that follow, for example. Recessing the substrate 106 by apredetermined amount d₁ advantageously may result in the elimination ofa phase difference between area 114 (light transmitted through the firstregion 102) and area 118 (light transmitted through the second region104), e.g., preferably establishing a phase difference of 0 or amultiple of 2π between areas 114 and 118, in some embodiments.

The light 138 is polarized in a predetermined direction, e.g., in theembodiment shown in FIG. 4, the incident light 138 is linearlypolarized. In the first region 102, in areas 114 where thepattern-forming material 110 does not reside, light 138 passes throughthe polarization rotating material 108 between the pattern-formingmaterial 110 in areas 112. The polarization of the light 138 is changeddue to the polarization rotating material 108 in area 114 in the firstregion 102. In addition, the phase of the light 138 may also be alteredby the presence of the polarization rotating material 108 by apredetermined amount of phase φ_(PRM) which is determined by thethickness t_(PRM) of the polarization rotating material 108, therefractive index n_(PRM), of the polarization rotating material 108, andthe exposure wavelength λ applied. On the other hand, in areas 118 inregion 104 where the pattern-forming absorber material 110 and thepolarization rotating material 108 do not reside, light 138 passesthrough only the substrate 106. Thus, a rotation of the direction of thepolarization plane of the light 138 does not occur in areas 118.

In accordance with preferred embodiments of the present invention, aportion of the substrate 106 is removed in areas 118 in order to offsetthe amount of phase shift φ_(PRM) due to the polarization rotatingmaterial 108 in the other areas 112, 114, and 116. For example, thesubstrate 108 is preferably removed in areas 118 to a recess depth t_(R)or d₁ to achieve a phase shift φ_(R) due to the change in materialthickness of the substrate 106 in areas 118.

The required amount d₁ or t_(R) of overetch or recess into the substrate106 in areas 118 of region 104 can be determined as follows. In order toachieve an absence of a phase difference between the light 138 passingthrough areas 114 of region 102 and light 138 passing through areas 118of region 104, the difference in the length of the optical paths must beeither 0 or a multiple of the wavelength λ of the light 138 used forexposure. This requirement can be expressed by the Equation 1:t _(PRM)(n _(PRM) −n _(a))+t _(R)(n _(s) −n _(a))=nλ;  Eq. 1for n=0 or 1, wherein t_(PRM) is the thickness of the polarizationrotating material 108, wherein t_(R) is the depth or dimension d₁ of therecess into the substrate 106 in region 104, wherein λ is the exposurewavelength of the light 138, and wherein n_(PRM), n_(s) and n_(a) arethe refractive indices of the polarization rotating material 108, themask substrate 106, and the gas ambient surrounding the mask 100 duringoperation in the exposure tool, respectively. Solving Equation 1 for thevariable t_(R) results in Equation 2 that may be used to calculate therequired recess depth t_(R) of the substrate 106, as follows:t _(R) =[t _(PRM)(n _(PRM) −n _(a))−nλ]/(n _(s) −n _(a)).  Eq. 2

Thus, by selecting an appropriate recess depth t_(R) of the substrate106 in areas 118 to avoid any phase difference in the optical pathsthrough areas 114 and 118, a degradation of the imaging quality into aphotosensitive material layer on a semiconductor device can be preventedwhen the lithography mask 100 containing a polarization rotatingmaterial 108 is used for patterning in a lithography process, resultingin improved pattern transfer.

Differences in light diffraction or light scattering behavior betweenthe first region 102 and the second region 104 due to the presence oftrenches through the polarization rotating material 108 and the recess(t_(R) or d₁) in the substrate 106 in the second region 104, and theabsence of such trenches in the first region 102, can be compensated forby adjustments in mask 100 critical dimensions (CD) or slight deviationsfrom the theoretical etch depth t_(R) in the substrate 106 in the secondregion 104, as examples.

In the lithography mask 100 shown in FIG. 4, for example, the pattern ofthe pattern-forming material 110 is the pattern that is transferred to amaterial layer of a semiconductor device using a positive photoresist,for example. Thus, lines or features formed on a material layer of asemiconductor device appear as the patterns of the absorber material 110shown in FIG. 4, for example.

The lithography mask shown in FIG. 4 comprises a binary orchrome-on-glass (COG) mask. Embodiments of the present invention mayalso be adapted to other types of lithography masks, such as attenuated(halftone) or alternating PSMs, and other types of masks, as examples.The manufacturing of non-COG masks containing polarization rotatingmaterials, however, is in general more complex, compared to theimplementation of a polarization rotating material 108 in a binary orCOG mask 100 as shown in FIGS. 1 through 4. Examples of manufacturingschemes for attenuated PSMs implementing embodiments of the presentinvention will be later described further herein.

Advantageously, the rotational angle of the polarization rotatingmaterial 108 may be changed by adjusting the thickness of thepolarization rotating material 108. The ability to adjust the angle byadjusting the polarization rotating material 108 thickness t_(PRM)enables the patterning of orthogonal and non-orthogonally alignedregions of features across a semiconductor device. Thus, two or moreregions of features may be formed comprising two or more orientations,e.g., wherein features extend lengthwise at varying angles from regionto region, e.g., from a first region 102 to a second region 104.

As an example, features formed on semiconductor devices may be alignedin an x direction in region 102 and in a y direction in region 104.Features formed on semiconductor devices may be aligned along an axis inregion 102, and features may be formed along an axis at an angle of 60degrees, or in principle at any other angle between about 0 to 180degrees, relative to the axis of region 102, in region 104.

Note that in some embodiments, an optional polarization filter materiallayer 144 may be included in the mask 100, thereby eliminating the needfor the availability of polarized light in the illumination system. Forexample, FIG. 6 shows a lithography mask 100 in accordance withembodiments of the present invention that includes a polarization filtermaterial layer 144 disposed on the backside of the substrate 106.Alternatively, the polarization filter material layer 144 may also beplaced or disposed between the polarization rotation film 108 and thesubstrate 106, for example, not shown. The optional polarization filtermaterial layer 144 will be described in more detail further herein.

Referring again to FIG. 1, preferred materials for the polarizationrotating material 108 will next be described. In some embodiments, thepolarization rotating material 108 preferably comprises a birefringentmaterial, for example. Passage of linearly polarized light through aproperly oriented “plate” or layer (e.g., the layer of polarizationrotating material 108) of birefringent material may be utilized toobtain a rotation of the plane of polarization of the light 138 shown inFIG. 4. As one example, for a rotation by 90 degrees, e.g., a half waveplate is required, corresponding to a difference of a half wavelength inthe optical path between an ordinary ray and an extraordinary ray of theincident light 138. In accordance with embodiments of the presentinvention, the plate thickness or the thickness L of the polarizationrotating material 108 needed to achieve a rotation by an angle Δθ can becalculated using Equation 3:L=(Δθ)λ/π(n _(e) −n _(or));  Eq. 3wherein n_(e) is the refractive index of the extraordinary ray of thelight 138, n_(or) is the refractive index of the ordinary ray of thelight 138, and λ is the wavelength of the polarized light 138.

Table 1 shows exemplary birefringent materials that may be used for thepolarization rotating material 108 in accordance with embodiments of thepresent invention. The materials shown in Table 1 have suitably highlevels of birefringence and transmittance for the wavelengths ofinterest indicated in the table, for example. However, otherbirefringent materials may alternatively be used. In one embodiment,preferably the polarization rotating material 108 comprises calcite forlight 138 having a wavelength of 248 nm, as an example. In anotherembodiment, the polarization rotating material 108 preferably comprisesβ-barium borate for light 138 having wavelengths of 193 nm or 248 nm, asanother example. Advantageously, these exemplary birefringent materialsthat may be used for the polarization rotating material 108 inaccordance with embodiments of the present invention are commerciallyavailable.

TABLE 1 Wave- Thickness of half wave Transmission length plate forpolarization Material Range (μm) (nm) n_(or) n_(e) Δn rotation by 90degrees (nm) Synthetic 0.15-4   185 1.676 1.69 0.014 6900 quartz (SiO₂)Synthetic 0.15-4   193.6 1.66 1.673 0.013 7420 quartz (SiO₂) Calcite0.22-1.9 200 1.9 1.6 0.3 320 (CaCO₃) Calcite 0.22-1.9 250 1.77 1.53 0.24402 (CaCO₃) rutile (TiO₂) 0.43-6.2 590 2.616 2.903 0.287 336 beta barium0.19-3.3 213 1.847 1.6746 0.172 561 borate (β- BaB₂O₄)Preferably, the polarization rotating material 108 comprises a highertransmittance to the wavelength of the light, which is possiblyachievable for 193 nm applications by fluorine (F) incorporation intothe birefringent materials, for example.

The polarization rotating material 108 is also referred to herein as alayer of birefringent material or a birefringent material. Theintegration of a layer of birefringent material 108 as part of thearchitecture of the mask 100 for the purpose of inducing the rotation ofthe polarization plane of incoming light represents a difficult but notinsurmountable technical challenge. Thin plates of the birefringentmaterial 108 may be cut out from a monocrystalline material piece of anappropriate size in a specific predetermined crystallographicorientation and mounted onto the mask substrate 106, for example. Onemethod of achieving this is by utilizing a method similar to a SmartCut™ by Silicon On Insulator Technologies method, for example. The SmartCut™ method may be used to mount thin birefringent material 108 plateshaving a thickness ranging from between a few tens to a few hundreds ofnm onto the mask substrate 106 in accordance with embodiments of thepresent invention, for example. Note that the Smart Cut™ technique hasbeen successfully applied in industry for the mounting of thinmonocrystalline (100) Si layers on (100) Si wafers to produce so-called“Mixed Orientation Substrate” (MOS) wafers desired for specialsemiconductor applications. In MOS wafers, a thin silicon dioxide layeris used as a “glue layer” between the mounted monocrystalline top layerand the monocrystalline substrate with a different crystallographicorientation. In accordance with embodiments of the present invention, asimilar approach may be followed for the mounting of birefringentmaterial 108 layers onto a mask substrate 106 of a lithography mask 100,for example.

In some embodiments, the polarization rotating material 108 preferablycomprises an optically active material. Rotation of the polarizationdirection of light occurs in optically active materials due tonon-symmetric arrangements of chemical bonds or groups of atoms, e.g.,due to “chirality.” Calculations of the contributions to opticalrotation from individual atoms may be made using a theory of circulardichroism, for example. Contributions to the optical rotation areadditive, but may vary in sign from atom to atom, for example. Similarmaterials may be used for the polarization rotating material 108 as areemployed in liquid crystal displays (LCDs), such as cholesteric liquidcrystal films with helical structures, which have shown a highrotational power of polarization, if the transmissiveness of the film isnot found to be too high in the deep ultraviolet (DUV) range. Thepolarization rotating material 108 may also comprise alicyclic polymerssuch as materials used in 193 nm resist chemistry, with optical activesubunits either in the polymer chain or in ligands; e.g., a camphor orsubstituted adamanthane type. Fluorine incorporation into the organicmaterials may help to raise the transmissivity for wavelengths shorterthan about 200 nm; e.g., the polarization rotating material 108 maycomprise a fluorine-containing organic material. Alternatively,optically active siloxanes may also be used for the polarizationrotating material 108, for example. Maximum values for Δn in colorlessorganic materials based on circular dichroism have been observed to bearound 0.3, for example.

FIG. 5 shows a lithography system 120 implementing a lithography mask100 of FIG. 4. Embodiments of the present invention also includelithography systems 120 such as the one shown in FIG. 5 that utilize orinclude the lithography masks 100, 200, 300, 400, or 500 shown in FIG.6, 9, 10, 11, or 15, respectively, as examples, which masks 100, 200,300, 400, or 500 will be described further herein.

Referring to FIG. 5, the lithography system 120 includes a support orstage 128 for a semiconductor device 130 or workpiece and a projectionlens system 126 disposed proximate the semiconductor device 130 support128, as shown. The projection lens system 126 may include a plurality oflenses, e.g., not shown, and may include a fluid disposed between thesemiconductor device 130 mounted on the support 128 and a last lens ofthe projection lens system 126, e.g., in an immersion lithographysystem, not shown. An illuminator 122 comprising an energy source, e.g.,a light source, is disposed proximate the projection lens system 126.

A novel lithography mask 100 of embodiments of the present invention isdisposed between the illuminator 122 and the projection lens system 126.The lithography mask 100 may comprise one mask in a mask set, not shown.The lithography mask 100 preferably includes a polarization rotatingmaterial 108 (not shown in FIG. 5; see FIG. 4) in at least one regionthat is adapted to alter or rotate polarized light 138 that impinges onthe mask 100 in the region of the polarization rotating material 108from the illuminator 122 to a predetermined type of polarization, andthen direct the altered polarized light towards the support 128 for thesemiconductor device 130 in some regions.

In some embodiments, the illuminator 122 is adapted to emit polarizedlight 138, for example. However, in other embodiments, the illuminator122 emits unpolarized light 138, and then a polarizer is used elsewherein the system 120 to polarize the light 138 before the light 138 entersthe polarization rotating material 108 of the lithography mask 100 ofembodiments of the present invention. For example, in FIG. 5, anoptional polarizer 124 is shown in phantom disposed between the mask 100and the illuminator 122. The polarizer 124 may comprise a polarizingfilter adapted to polarize light 138 in a predetermined polarization,for example.

Alternatively, the lithography system 120 may include an optionalpellicle 140 adapted to support the mask 100, as shown in phantom. Alsooptionally, the pellicle 130 may include a polarizer 142, also shown inphantom. The polarizer 142 of the pellicle 140 may comprise a polarizingfilter adapted to polarize light 138 in a predetermined polarization,for example.

The lithography system 120 may comprise a lithography system thatutilizes near ultraviolet (UV) or preferably deep ultraviolet (UV)light; e.g., light with wavelengths of 248 nm, 193 nm or 157 nm,although light having other wavelengths may also be used. Thelithography system 120 may comprise a stepper or a step-and-scanapparatus, wherein the stage 128 is adapted to move the semiconductordevice 130 while the mask 100 is moved in the exposure process, forexample. The lithography system 120 may also be adapted for immersionlithography applications, for example, not shown.

In other embodiments of the present invention, rather than usinglinearly polarized illumination or light 138, a polarization filter 144may be incorporated in the mask 100, as shown in FIG. 6, which shows across-sectional view of a lithography mask 100 in accordance withadditional preferred embodiments of the present invention. For example,a polarizing filter material layer 144 may be disposed on the back ofthe mask 100 as shown in FIG. 6; e.g., on an opposite side of the mask100 from the polarization rotating material 108. Alternatively, thepolarizing filter material layer 144 may be disposed between thepolarization rotating material 108 and the mask substrate 106 (notshown).

In the embodiment shown in FIG. 6, preferably, the polarizing filtermaterial layer 144 is adapted to polarize light 138 in a firstpolarization orientation, and the polarization rotating material 108 isadapted to alter light after it passes through the polarizing filtermaterial layer 144 to a second polarization orientation in the firstregion 104 of the mask 100, for example. Thus, the pattern of thelithography mask 100 is transferred to a device using a secondpolarization orientation in the first region 102 and using a firstpolarization orientation in the second region 104, for example. Thelight 138 entering the first region 104 is first polarized by thepolarizing filter material layer 144 and then in addition theorientation of its plane of polarization is rotated while passingthrough the polarization rotating material 108.

The polarizing filter material layer 144 and/or the optional polarizers124 or 142 of the lithography system 120 may comprise patternedgratings: e.g., comprising sub-resolution assist features (SRAF) toosmall to be printed on a semiconductor device, in some embodiments. Thepolarizing filter material layer 144 and/or the optional polarizers 124or 142 may comprise a thin material layer, gratings utilizing absorbingmaterials, transparent foil materials, or similar polarizers that areattached to, integrated into, or mounted to the mask 100 or are locatedin the optical path in the lithography system 120, for example.

In yet another embodiment of the present invention, the order of thedeposition of the pattern-forming material 110 and the polarizationrotating material 108 may be reversed, for example (not shown in thedrawings). Referring again to FIGS. 1 through 4, the pattern-formingmaterial 110 may be deposited directly over the substrate 106, and thepolarization rotating material 108 may be deposited over thepattern-forming material 110. The polarization rotating material 108 andthe pattern-forming material 110 are then patterned and the substrate106 is over-etched to compensate for the phase shift due to the presenceof the polarization rotating material 108. Thus, a plurality of patternsfor features may be formed in an attenuating or opaque material 110disposed over or under the polarization rotating material 108, forexample.

Thus, embodiments of the present invention comprise methods of usingpolarized light created by different means along the illumination pathor optical path of a lithography system. The polarized light may belocally directionally rotated to be the most beneficial for a particularprocess window corresponding to the orientation of individual designfeatures, in order to obtain a high contrast image, by means of anadditional polarization rotating material 108 layer on the mask 100 andby a location dependent thickness adjustment of the substrate 106 of themask 100.

Embodiments of the present invention include methods of manufacturingsemiconductor devices and devices manufactured using the novellithography masks 100 described herein. FIG. 7 shows a cross-sectionalview of a semiconductor device 130 that has a layer of photoresist 136disposed thereon that has been patterned using a lithography mask 100 ofan embodiment of the present invention. FIG. 8 shows the semiconductordevice 130 of FIG. 7 after the layer of photoresist 136 has been used asa mask to pattern a material layer 134 of the semiconductor device 130.

Referring to FIG. 7, the semiconductor device 130 includes a workpiece132. The workpiece 132 may include a semiconductor substrate comprisingsilicon or other semiconductor materials covered by an insulating layer,for example. The workpiece 132 may also include other active componentsor circuits, not shown. The workpiece 132 may comprise silicon oxideover single-crystal silicon, for example. The workpiece 132 may includeother conductive layers or other semiconductor elements, e.g.,transistors, diodes, etc. Compound semiconductors, GaAs, InP, Si/Ge, orSiC, as examples, may be used in place of silicon. The workpiece 132 maycomprise a silicon-on-insulator (SOI) substrate, for example.

The workpiece 132 may comprise regions 133 where features will be formedin a first orientation and regions 135 where features will be formed inat least one second orientation. In some embodiments, the firstorientation and a second orientation may comprise a vertical directionand/or a horizontal direction, the horizontal direction beingsubstantially perpendicular to the vertical direction, for example. Thevertical direction and the horizontal direction comprise directions on aplanar surface of the workpiece 132, for example, that are substantiallyperpendicular to one another. The first orientation and the at least onesecond orientation may comprise other non-perpendicular directions andmay comprise three or more directions, for example, not shown.

In a preferred embodiment of the present invention, a method offabricating the semiconductor device 130 includes first, providing theworkpiece 132. A material layer 134 to be patterned is deposited overthe workpiece 132. The material layer 134 may comprise a conductive,insulating, or semiconductive material, or multiple layers orcombinations thereof, as examples. In some embodiments, the materiallayer 134 preferably comprises a semiconductive material such as siliconor polysilicon, for example, although other materials may also be used.In an embodiment where transistors are formed, the material layer 134may comprise a gate dielectric material comprising an insulator and agate material formed over the gate dielectric material, for example.

A layer of photosensitive material 136 is deposited over the materiallayer 134. The layer of photosensitive material 136 may comprise aphotoresist, for example. The layer of photosensitive material 136 ispatterned using the lithography mask 100 of FIG. 4 or 6 (or masks 200,300, 400, or 500 of FIGS. 9, 10, 11, and 15, respectively, to bedescribed further herein) to form a latent pattern for the plurality offeatures to be formed in the material layer 134. The layer ofphotosensitive material 136 is developed, as shown in FIG. 7.

In some embodiments, the layer of photosensitive material 136 is used asa mask while the material layer 134 is etched using an etch process,forming a plurality of features in the material layer 134, as shown in across-sectional view in FIG. 8. The layer of photosensitive material 136is then removed Advantageously, a plurality of first features and aplurality of second features may be formed, wherein at least one firstfeature comprises a first dimension and at least one second featurecomprises a second dimension, wherein the second dimension issubstantially the same as the first dimension, due to the novelpolarization-rotating masks 100, 200, 300, 400, and 500 of embodimentsof the present invention, for example.

In other embodiments, the layer of photosensitive material 136 is usedas a mask to affect an underlying material layer 134 of thesemiconductor device 130, for example. Affecting the material layer 134may comprise etching away exposed portions of the material layer 134,implanting a substance such as a dopant or other materials into theexposed portions of the material layer 134, or forming a second materiallayer over exposed portions of the material layer 134, as examples (notshown), although alternatively, the material layer 134 may be affectedin other ways.

The polarization rotating material 108 alters or adjusts thepolarization of the light 138 in region 133 which corresponds to thefirst region 102 of the mask 100. The polarization of the light inregion 135 which corresponds to the second region 104 of the mask 100 isnot affected, because the polarization rotating material 108 is notpresent in the path of the light 138 in the second region 104 of themask 100.

As an example, the first region 102 of the mask 100 may comprise apattern for vertical features oriented in a y direction, and the secondregion 104 of the mask 100 may comprise a pattern for horizontalfeatures oriented in an x direction. The polarization rotating material108 may be adapted to rotate a polarization of light 138 by 90 degreesin this example. If light 138 polarized in the x direction is used inthe exposure process to pattern the semiconductor device 130, the light138 is allowed to pass through the patterns for features in the secondregion 104 of the mask 100 with an unchanged polarization, so thathorizontal features in region 135 of the semiconductor device 130 areexposed with light polarized in the x direction. However, light 138impinging upon the patterns for vertical features in the first region102 of the mask 100 is rotated by 90 degrees by the polarizationrotating material 108 to the y direction, so that advantageously,vertical features in region 133 of the semiconductor device 130 areexposed with light polarized in the y direction. Advantageously, onlyone mask 100 may be used to pattern a semiconductor device 130 havingfeatures in more than one orientation, using one exposure process,wherein patterns of regions 102 and 104 are optimally exposed to anoptimal polarization rotation due to the rotation of a portion of thelight 138 by the polarization rotating material 108 of the novel mask100.

Features of semiconductor devices 130 manufactured using the novelmethods described herein may comprise transistor gates, conductivelines, vias, capacitor plates, and other features, as examples.Embodiments of the present invention may be used to pattern features ofmemory devices, logic circuitry, and/or power circuitry, as examples,although other types of ICs and devices may also be fabricated using themanufacturing techniques and processes described herein.

Embodiments of the present invention may be used in lithographyprocesses that utilize positive or negative photoresists for patterningsemiconductor devices 130, for example.

The lithography masks shown in FIGS. 1 through 4 comprise binary maskswherein the pattern-forming material 110 comprises an absorbing materialsuch as chrome. Embodiments of the present invention may also beimplemented in attenuating phase shifting masks, as shown in FIGS. 9through 15. Like numerals are used for the various elements in FIGS. 9through 15 that were used to describe the previous figures, and to avoidrepetition, each reference number shown in FIG. 9 through 15 is notdescribed again in detail herein. Rather, similar materials x02, x04,x06, x08, etc. . . . are preferably used for the various material layersshown as were described for FIGS. 1 through 8, where x=1 in FIGS. 1through 8, x=2 in FIG. 9, x=3 in FIG. 10, etc.

FIG. 9 shows a cross-sectional view of an attenuating phase shiftinglithography mask 200 in accordance with an embodiment of the presentinvention. In FIG. 9, the pattern-forming material 250 preferablycomprises an attenuating material (also referred to as a halftone (HT)material) such as MoSi, for example. The attenuating material 250preferably comprises a thickness of about 100 nm or less, and morepreferably comprises a thickness of about 10 to 50 nm in someembodiments, for example, although alternatively, the attenuatingmaterial 250 may comprise other dimensions. In this embodiment, forexample, the pattern-forming material 250 comprises an attenuated phaseshift mask (PSM) absorber, and light emerging away from the mask 200 hasa 180 degree phase difference between attenuating material 250 coveredand the other materials, although the polarization rotating material 208may also contribute to a phase change.

In the embodiment shown in FIG. 9, a polarization rotating material 208is formed in the first region 202 of the mask 200, and anon-polarization rotating material 248 is formed in the second region204 of the mask 200, e.g., over the substrate 206, before thepatterning-forming material 250 is deposited. The polarization rotatingmaterial 208 may be deposited over the entire mask 200 and then removedfrom over the second region 204. The non-polarization rotating material248 is then deposited over the entire mask 200 and is then removed fromover the first region 202. Light 238 passes through the first region 202at areas 212 and 214 and through the second region 204 at areas 216 and218. The polarization of light 238 is rotated in the first region 202but not in the second region 204, for example.

The non-polarization rotating material 248 preferably comprises amaterial that does not affect the polarization of light impinged uponthe mask 200, and more preferably comprises a material having acomparable thickness and comparable absorption characteristics as thepolarization rotating material 208, for example, in order to achieveoptimal focus conditions. Preferably, the thickness d₂ of thepolarization rotating material 208 and the thickness d₃ of thenon-polarization rotating material 248 are substantially the same, insome embodiments. In other embodiments, the thickness d₂ of thepolarization rotating material 208 and the thickness d₃ of thenon-polarization rotating material 248 preferably do not vary by morethan about 100 nm, for example. The balancing of the total lightabsorption through all layers in region 204 as compared to region 202will ensure equal exposure dose requirements for identical patternsplaced in regions 202 and 204, for example. Small deviations in doserequirements not balanced by absorption adjustment in thenon-polarization rotating material 248 may be alleviated by adjustmentsof mask CDs related to patterns in region 204. By having similarunderlayers (e.g., material layers 208 and 248, respectively) below thepattern-forming materials 250 in each of the regions 202 and 204, aphase difference of 180 degrees may be, and is preferably, maintainedbetween areas 212 and 214 and also between areas 216 and 218.

The choice of material for the non-polarization rotating material 248may depend on the optical properties and chosen thickness of thepolarization rotating material 208, for example. Spin-on-glasscontaining a dye and/or having a predetermined dopant content, forexample, may be used as a material for the non-polarization rotatingmaterial 248, which provides a high flexibility regarding the properadjustment of the absorption coefficient and has suitable deposition andremoval characteristics. In the case of excessively high absorption, Fincorporation into the non-polarization rotating material 248 may helpto increase transmissivity for wavelengths of about 200 nm or less, forexample. No requirements regarding the refractive index of thenon-polarization rotating material 248 may arise if light passingthrough the polarization rotating material 208 is rotated by 90 degrees(e.g., creating an absence of interference between light of regions 202and 204). For rotation angles different than 90 degrees, potentiallydetrimental interference effects may occur, which may be avoided if therefractive index of material 204 is adjusted in such a way that thephase difference in the light paths through regions 202 and 204 remainseither 0 or an integer multiple of 2π, for example. This may require amaterials optimization for both absorption and refractive indices, forexample.

FIG. 10 shows a cross-sectional view of an attenuating phase shiftinglithography mask 300 in accordance with another embodiment of thepresent invention. In this embodiment, the polarization rotatingmaterial 308 is formed in the first region 302 but not in the secondregion 304. The pattern-forming material 352 in the second region 304 ispreferably thicker than the pattern-forming material 350 in the firstregion 302, as shown. The pattern-forming material 352 preferablycomprises a different attenuating material than the pattern-formingmaterial 350 with an absorption coefficient which is lower than that ofmaterial 350 in the first region 302 in this embodiment.

The material selection for the pattern-forming material 352 andpotential material adjustment in order to provide suitable values forthe absorption coefficient and the refractive index is preferablyachieved by substantially meeting two conditions: first, at a thicknessof d₅=d₂+d₄, wherein d₂ is the thickness of the patterning-formingmaterial 350 in the first region 302, d₄ is the thickness of thepolarization rotating material 308 in the first region 302, and d₅ isthe thickness of the pattern-forming material 352 in the second region304, the pattern-forming material 352 exhibits the same amount of lightattenuation as the pattern-forming material 350 having the thickness d₄in region 302; and second, a phase angle difference of 180 degrees ismaintained between light passing through the mask areas 316 of region304 covered with material 352 and light passing through the adjacentareas 318 not covered by material 352.

The fulfillment of the first condition mentioned above ensures that thetop surfaces z₁ and z₂ of the pattern-forming materials 350 and 352,respectively, remain at substantially the same height. Thereby,requirements for the best focus position for regions 302 and 304 remainidentical, and a degradation in the overall depth of focus budget forthe entire mask 300 is avoided. The fulfillment of the second conditionmentioned above ensures that a contrast-enhancing attenuated phaseshifter effect is also established in the second region 304, forexample.

Note that if the polarization rotating material 308 in the first region302 is slightly absorbing, the absence of the polarization rotatingmaterial 308 in the second region 302 may be compensated for by criticaldimension (CD) adjustments in the patterns of the pattern-formingmaterial 352, in order to maintain the same dose requirements for thefirst region 302 and the second region 304, for example.

In the embodiment shown in FIG. 10, light 338 passes through the firstregion 302 at areas 312 and 314 and through the second region 304 atareas 316 and 318 of the mask 300. The polarization of light 338 isrotated in the first region 302 but not in the second region 304, forexample.

In the case of rotation of the plane of polarized light by 90 degrees bythe presence of the polarization rotating material 308 in region 302,interference between light emitted from regions 302 and 304 will notoccur. In order to avoid potentially detrimental interference effects ofthis nature in the case of polarization rotation angles other than 90degrees, an additional recess by an amount d_(R) into the substrate 306may be included as a means to maintain an optical path differencebetween light emitted from the attenuator-free areas 314 and 318 (i.e.,the areas 314 and 318 not including materials 350 and 352 which areattenuating, respectively) of regions 302 and 304, respectively, at 0 orinteger multiples of the exposure wavelength λ. The amount of recessd_(R) or over-etch of the substrate 306 in region 304 in this embodimentmay be calculated using Equation 4:d _(R) =[nλ−d ₂(n ₂ −n _(a))]/(n _(s) −n _(a));  Eq. 4wherein d_(R) is the depth of recess of the substrate 306, wherein n₂and d₂ are the refractive index and the thickness, respectively, of thepolarization rotating material 308, wherein n_(s) is the refractiveindex of the mask 300 substrate 306, wherein n_(a) is the refractiveindex of the gaseous ambient around the mask, wherein λ is the exposurewavelength, and wherein n is an integer (1, 2, 3 . . . ).

FIG. 11 shows a cross-sectional view of an attenuating phase shiftinglithography mask 400 in accordance with another embodiment of thepresent invention. In this embodiment, the same pattern-forming material450 is used in the first region 402 and the second region 404, and thepolarization rotating material 408 is formed only in the first region402. Preferably, the polarization rotating material 408 comprises athickness of about 200 nm or less, and more preferably comprises athickness of about 100 nm or less, in this embodiment, in order to avoiddepth of focus (DOF) latitude issues due to different positions of thetop surfaces of the mask 400 in the first and second regions 402 and404, respectively, due to the absence of the polarization rotatingmaterial 408 in the second region 404.

Light 438 passes through the first region 402 at areas 412 and 414 andthrough the second region 404 at areas 416 and 418. The polarization oflight 438 is rotated in the first region 402 but not in the secondregion 404, for example.

FIGS. 12 through 15 show cross-sectional views of an attenuating phaseshifting lithography mask 500 in accordance with an embodiment of thepresent invention at various stages of manufacturing. In thisembodiment, two polarization rotating material layers 508 a and 508 b,are employed in the mask architecture. The polarization rotatingmaterial layers 508 a and 508 b may comprise either two differentmaterials with differing polarization rotating properties or,alternatively, they may comprise the same type of polarizing rotatingfilm material, but with differing thickness requirements for layers 508a and 508 b, to be described herein in more detail.

For example, a first polarization rotating material 508 a is disposedover a substrate 506, a pattern-forming material 550 comprising anattenuating material is disposed over the first polarization rotatingmaterial 508 a, and a second polarization rotating material 508 b isdisposed over the pattern-forming material 550. If the firstpolarization rotating material 508 a induces a rotation of thepolarization plane by β degrees, then the properties and thickness ofthe second (upper) polarization rotating material 508 b are preferablychosen to induce an additional rotation of the polarization plane byeither (−β) or (360−β) degrees, for example. This ensures that the light538 passing through the complete mask stack (e.g., material layers 508a, 550, and 508 b) in area 516 will not be subjected to any rotation ofits polarization plane at all, as experienced by light passing throughsection 518 in region 504.

Full exploitation of the contrast-enhancing effect of the phase shiftingmask concept depends on the presence of a 180 degree phase shift betweenmask areas 512 and 516 (see FIG. 15) covered with the attenuated andabsorber material comprising the pattern-forming material 550 andadjacent areas 514 and 518 free of the absorber material 550. Thiscondition is preferably also fulfilled for light passing through areas516 and 518 and can be met by forming a recess d₆ in the substrate 506in area 118 of region 504, as shown in FIG. 15. The amount of recess d₆may be determined using Equation 5:(d _(PRM2) n _(PRM2) +d _(ATT) n _(ATT) +d _(PRMl) n _(PRM1) +d _(R) n_(s))−(d _(PRM2) +d _(ATT) +d _(PRM1) +d ₆)n _(a)=(λ/2)(2n−1);  Eq. 5for n=1, 2, 3 . . . , wherein d_(PRM1) and n_(PRM1) are the thicknessand refractive index, respectively, of the first (lower) polarizationrotating material 508 a, wherein d_(PRM2) and n_(PRM2) are the thicknessand refractive index of the second (upper) polarization rotatingmaterial 508 b; wherein d_(ATT) and n_(ATT) are the thickness andrefractive index, respectively, of the attenuating film or thepattern-forming material 550; wherein n_(s) is the refractive index ofthe mask substrate 506 material, and wherein n_(a) is the refractiveindex of the gaseous ambient surrounding the mask 500, for example.

Solving Equation 5 for the required recess depth d₆ of the substrate 506in the second region 504 results in Equation 6:d ₆=((2n−1)(λ/2)−d _(PRM2)(n _(PRM2) −n _(a))−d _(ATT)(n _(ATT) −n_(a))−d _(PRM1)(n _(PRM1) −n _(a)))/(n _(s) −n _(a))  Eq. 6For polarization rotation different than 90 degrees, an alternativerequirement for the recess depth d₆ of the substrate 506 may be used, inorder to ensure the absence of potentially detrimental interferenceeffects between regions 502 and 504 of the mask. The recess depth d₆ ofthe substrate 506 may be calculated using Equation 7 in theseembodiments, below:d ₆=(nλ−d _(PRM1)(n _(PRM1) −n _(a)))/(n _(s) −n _(a)).  Eq. 7

To manufacture the mask 500, after depositing the second polarizationrotating material 508 b, the second polarization rotating material 508 bis removed from over the first region 502, as shown in FIG. 13, e.g., bydepositing a layer of photoresist (not shown) over the secondpolarization rotating material 508 b, patterning the layer ofphotoresist, and using the layer of photoresist as a mask while portionsof the second polarization rotating material 508 b in the first region502 are etched away.

The pattern-forming material 550 in the first region 502 and the secondpolarization rotating material 508 b and pattern-forming material 550 inthe second region 504 are patterned with a desired pattern, as shown inFIG. 14. The first region 502 is masked (not shown) and the secondpolarization rotating material 508 b is patterned in the second region504, as shown in FIG. 15.

Light 538 passes through the first region 502 at areas 512 and 514 andthrough the second region 504 at areas 516 and 518. The polarization oflight 538 is rotated in the first region 502 in areas 512 and 514 by thefirst polarization rotating material 508 a. The polarization of light isrotated in the second region 504 by both the first and secondpolarization rotating materials 508 a and 508 b in area 516 but not inarea 518, for example.

In this embodiment, the substrate 506 may be recessed in areas 518 by anamount d₆ determinable by Equations 6 or 7 above in the second region504 in order to ensure maximum contrast enhancement by the attenuatedphase shifter (e.g., the pattern-forming material 550) in region 504 andto avoid potentially image degrading interference effects betweenregions 502 and 504, for example.

Advantages of embodiments of the invention include providing novellithography masks 100, 200, 300, 400, and 500 and methods of fabricationthereof that allow polarized light processing for high contrast imagingfor differently oriented features. High contrast images of twoorthogonal features, or other angles depending on the active polarizer(e.g., the polarization rotating material 108, 208, 308, 408, 508 a or508 b) capability, may be made with a single exposure process usingpolarized light.

Embodiments of the present invention allow chip designers the ability touse virtually any orientation of features, such as gates having the sameacross-the-chip line width variation (ACLV), which results in anincrease in throughput and thus a reduction in costs. Contrast in theexposure process is improved, resulting in increased resolution and theability to print smaller features.

Embodiments of the present invention include manufacturing process flowsfor lithography masks 100 that ensure appropriate control of the phaseshift despite the presence of an additional polarization-rotating film,e.g., polarization rotating materials 108, 208, 308, 408, 508 a, and 508b. Advantageously, regions of features may be individually custompolarized with a desired polarization, using the novel lithography masks100 described herein. Features aligned in different directions ofsemiconductor devices 130 may be exposed with light polarizeddifferently in various regions 133 and 135, for example (see FIG. 8).Advantageously, a plurality of first features and a plurality of secondfeatures may be formed in a material layer 134, wherein the firstfeatures and second features have different orientations. The firstfeatures may comprise a first dimension and the second features maycomprise a second dimension, the second dimension being substantiallythe same as the first dimension.

Although embodiments of the present invention and their advantages havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the invention as defined by the appended claims.For example, it will be readily understood by those skilled in the artthat many of the features, functions, processes, and materials describedherein may be varied while remaining within the scope of the presentinvention. Moreover, the scope of the present application is notintended to be limited to the particular embodiments of the process,machine, manufacture, composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the disclosure of the present invention,processes, machines, manufacture, compositions of matter, means,methods, or steps, presently existing or later to be developed, thatperform substantially the same function or achieve substantially thesame result as the corresponding embodiments described herein may beutilized according to the present invention. Accordingly, the appendedclaims are intended to include within their scope such processes,machines, manufacture, compositions of matter, means, methods, or steps.

1. A method of manufacturing a device, the method comprising: providinga lithography mask including a substrate having a first region and asecond region, a polarization rotating material being disposed over atleast the first region of the substrate, the polarization rotatingmaterial adapted to alter a polarization and a phase of light in atleast the first region, the substrate being recessed in the secondregion, the lithography mask including a pattern for a plurality offirst features in the first region and a pattern for a plurality ofsecond features in the second region, and the lithographic maskincluding a phase shifting compensating feature disposed in at leastportions of the second region adapted to compensate for the alteredphase of light due to the polarization rotating material in the firstregion; exposing a layer of photosensitive material on a workpiece tolight using the lithography mask as a mask, forming the plurality offirst features and the plurality of second features in the layer ofphotosensitive material, wherein the polarization rotating material ofthe lithography mask alters a polarization of the light in at least thefirst region; and developing the layer of photosensitive material. 2.The method according to claim 1, wherein the first features are alignedin a first direction and the second features are aligned in a seconddirection, the second direction being disposed at an angle of greaterthan 0 degrees and less than 180 degrees to the first direction.
 3. Themethod according to claim 1, further comprising using the layer ofphotosensitive material as a mask to affect a material layer of theworkpiece.
 4. The method according to claim 3, wherein affecting thematerial layer of the workpiece comprises etching the material layer,implanting a substance into the material layer, or forming a secondmaterial layer over the material layer.
 5. The method according to claim4, wherein the material layer comprises a conductive material, aninsulating material, a semiconductive material, or multiple layers orcombinations thereof.
 6. The method according to claim 1, furthercomprising: using the layer of photosensitive material as a mask topattern a material layer of the workpiece; forming the plurality offirst features and plurality of second features in the material layer;and removing the layer of photosensitive material.
 7. The methodaccording to claim 6, wherein forming the plurality of first features inthe material layer comprises forming at least one first featurecomprising a first dimension, wherein forming the plurality of secondfeatures in the material layer comprises forming at least one secondfeature comprising a second dimension, and wherein the second dimensionis substantially the same as the first dimension.
 8. A lithographysystem comprising: a support for a device having a material layer to bepatterned disposed thereon; a projection lens system proximate thesupport for the device; an illuminator proximate the projection lenssystem; and a lithography mask disposed between the illuminator and theprojection lens system, the lithography mask comprising (a) a pluralityof patterns for features disposed in a first region and a second region,(b) a polarization rotating material disposed in at least the firstregion, the polarization rotating material being adapted to alter apolarization and a phase of light in at least the first region, and (c)a phase shifting compensating feature disposed in at least portions ofthe second region adapted to compensate for the altered phase of lightdue to the polarization rotating material in the first region.
 9. Thelithography system according to claim 8, wherein the illuminator isadapted to emit polarized light, or further comprising a polarizingfilter disposed between the illuminator and the lithography mask, apolarizing filter disposed on a pellicle supporting the lithographymask, or a polarizing filter material layer disposed on the lithographymask.
 10. The lithography system according to claim 9, wherein thepolarizer filter or polarizing filter material layer comprisesub-resolution assist features (SRAF), a thin material layer, gratingsutilizing absorbing materials, or transparent foil materials that areattached to, integrated into, or mounted to the lithography mask orlocated in an optical path in the lithography system.
 11. Thelithography system according to claim 8, wherein the lithography systemutilizes ultraviolet (UV) or deep UV (DUV) light.
 12. The lithographysystem according to claim 11, wherein the lithography system utilizesimmersion lithography.
 13. The lithography system according to claim 8,wherein the lithography mask further comprises a polarizing filtermaterial adapted to polarize light and disposed on the first region andthe second region.
 14. A lithography system comprising: a support for adevice having a material layer to be patterned disposed thereon; aprojection lens system proximate the support for the device; anilluminator proximate the projection lens system; and a lithography maskdisposed between the illuminator and the projection lens system, thelithography mask comprising (a) a substrate comprising a first regionand a second region, (b) a polarization rotating material disposed on atleast the first region, the polarization rotating material being adaptedto rotate light in at least the first region, and (c) a first pattern inthe first region and a second pattern in the second region disposed onthe polarization rotating material, wherein the polarization rotatingmaterial is disposed in the second region under the second pattern, butis not disposed a remaining portion of the second region not under thesecond pattern.
 15. The lithography system according to claim 14,wherein the illuminator is adapted to emit polarized light, or furthercomprising a polarizing filter disposed between the illuminator and thelithography mask, a polarizing filter disposed on a pellicle supportingthe lithography mask, or a polarizing filter material layer disposed onthe lithography mask.
 16. The lithography system according to claim 15,wherein the polarizer filter or polarizing filter material layercomprise sub-resolution assist features (SRAF), a thin material layer,gratings utilizing absorbing materials, or transparent foil materialsthat are attached to, integrated into, or mounted to the lithographymask or located in an optical path in the lithography system.
 17. Thelithography system according to claim 14, wherein the lithography systemutilizes ultraviolet (UV) or deep UV (DUV) light.
 18. The lithographysystem according to claim 17, wherein the lithography system utilizesimmersion lithography.
 19. The lithography system according to claim 14,wherein the pattern of the first region is orthogonal to the pattern ofthe second region.